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812002

Solder Wire, Lead Free, 1mm Diameter, 217°C, 250g, Alloy 97.1, 2.6, 0.3 Sn, Ag, Cu

MULTICOMP 812002

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Manufacturer:
MULTICOMP MULTICOMP
Manufacturer Part No:
812002
Order Code:
1015454
Product Range
Multicomp Type 400 Solder Wire
Technical Datasheet:
812002   Datasheet
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Product Range Selector (Multicomp Type 400 Solder Wire)

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Product Information

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:
Lead Free

:
No Clean and Rosin Flux

:
97.1, 2.6, 0.3 Sn, Ag, Cu

:
1mm

:
0.039"

:
217°C

:
250g

:
8.818oz

:
Multicomp Type 400 Solder Wire

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Technical Documents (3)

CAD Downloads

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Terms and Conditions

CAD Models - Notice
CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
Use of these CAD models and other options provided are downloaded and used entirely at your own risk and by continuing you confirm acceptance of the above.

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Product Overview

The 812002 is a Solder Wire made of lead-free alloy. The Multicomp Type 400 designed for users who require a halide-free formulation. The cored wire is manufactured with a range of flux contents. Although users will normally be using products with a nominal flux content of 3%, the superior performance of this product may allow a lower flux content to be specified e.g. 2.2%. This will further improve residue appearance by reducing the quantity. All are available in alloys conforming to national and international standards, including lead-free alloys. The Multicomp Type 400 no-clean solid flux for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. It is also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning.
  • No-clean Flux
  • Halide free version-type 400
  • Mild odour
  • Fast soldering-range of activities to suit all applications
  • Clear residues
  • Good spread on copper, brass and nickel
  • Heat stable-low spitting
  • Multicomp products are rated 4.6 out of 5 stars
  • 12 month limited warranty *view Terms & Conditions for details
  • 96% of customers would recommend to a friend

Applications

Maintenance & Repair, Industrial, Communications & Networking, Audio

Footnotes

Lead Free. Material Composition: 97.1% Tin, 2.6% Silver, 0.3% Copper. Rosin based flux, halide activated, normal activation level
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More stock available week commencing 19/06/23
Standard lead time for this product is 12 weeks.

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