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No Longer Manufactured
Product Information
ManufacturerMICRON
Manufacturer Part NoMT40A4G8BAF-062E:B
Order Code3754380
Technical Datasheet
DRAM TypeDDR4
Memory Density32Gbit
Memory Configuration4G x 8bit
Clock Frequency Max1.6GHz
IC Case / PackageTFBGA
No. of Pins78Pins
Supply Voltage Nom1.2V
IC MountingSurface Mount
Operating Temperature Min0°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
- TwinDie™ 1.2V DDR4 SDRAM
- Uses 16Gb micron die, two ranks (includes dual CS#, ODT, and CKE balls)
- Each rank has 4 groups of 4 internal banks for concurrent operation
- VDD = VDDQ = 1.2V (1.14 to 1.26V), 1.2V VDDQ-terminated I/O
- JEDEC-standard ball-out, low profile package
- 3200MT/s data rate, 22-22-22 target CL-nRCD-nRP
- BG[1:0] bank group address, BA[1:0] bank address in bank group
- 128K A[16:0] reo address, 1K A[9:0] column address
- 78-ball FBGA package, commercial temperature range from 0°C ≤ TC ≤ 95°C
Technical Specifications
DRAM Type
DDR4
Memory Configuration
4G x 8bit
IC Case / Package
TFBGA
Supply Voltage Nom
1.2V
Operating Temperature Min
0°C
Product Range
-
Memory Density
32Gbit
Clock Frequency Max
1.6GHz
No. of Pins
78Pins
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Dec-2015)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Singapore
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Singapore
Country in which last significant manufacturing process was carried out
Tariff No:85423239
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.000001