Product Information
Alternatives for ENW89819AYKF
1 Product Found
Product Overview
Panasonic’s new PAN1326C Host Controlled Interface (HCI) Bluetooth RF module brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564, to an easy to use module format. PAN1326C is Bluetooth 4.2 compliant and of- fers best-in-class RF performance with about twice the range of other Bluetooth low-energy solutions. Using Panasonic’s tiny footprint technology the module only is 85.5mm². The module is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing. This module has been designed to be 100% pin compatible with previous generation of Texas Instruments based Bluetooth HCI modules.
- Bluetooth-4.2-compliant up to the HCI layer
- Dimensions is 9.0mm x 9.5mm x 1.8mm
- Based upon TI’s CC2564C
- Interfaces: UART, GPIO, PCM
- Scatternet: up to three piconets simultaneously
- Output power 12 dBm
- Sleep mode 135 µA
- Operating temperature range -45 ºC to +85 ºC
- Receiver sensitivity -93 dBm
Warnings
Market demand for this product has caused an extension in leadtimes. Delivery dates may fluctuate. Product exempt from discounts.
Technical Specifications
Panasonic
Wireless Connectivity
PAN1326C Daughterboard, Texas Instruments Development Board for PAN1326C, Adapter Board, Launch Pad
To Be Advised
PAN1326C
Bluetooth Classic & Low Energy
PAN13x6
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:Germany
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate