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DILB18P223TLF
IC & Component Socket, 18 Contacts, DIP Socket, 2.54 mm, 7.62 mm, Copper Alloy
Image is for illustrative purposes only. Please refer to product description.
No Longer Stocked
Product Information
ManufacturerAMPHENOL COMMUNICATIONS SOLUTIONS
Manufacturer Part NoDILB18P223TLF
Order Code2678539
No. of Contacts18Contacts
Connector TypeDIP Socket
Pitch Spacing2.54mm
Product Range-
Row Pitch7.62mm
Contact MaterialCopper Alloy
Contact PlatingTin Plated Contacts
SVHCNo SVHC (17-Dec-2015)
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Product Overview
The DILB18P223TLF is a 18-position 2-row black open frame stamped and formed DIP Socket with standard insulator. It has tin plated copper alloy contacts and UL94V-0 polyester insulator. Integrated circuits are usually called ICs or chips. They are complex circuits which have been etched onto tiny chips of semiconductor (silicon). The chip is packaged in a plastic holder with pins spaced on a 0.1-inch grid which will fit the holes on stripboard and breadboards. Very fine wires inside the package link the chip to the pins.
- 9 Contacts per row
- 1000VACrms Minimum withstanding voltage
- 30MΩ Maximum at 6VDC Contact resistance
Applications
Industrial
Technical Specifications
No. of Contacts
18Contacts
Pitch Spacing
2.54mm
Row Pitch
7.62mm
Contact Plating
Tin Plated Contacts
Connector Type
DIP Socket
Product Range
-
Contact Material
Copper Alloy
SVHC
No SVHC (17-Dec-2015)
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Taiwan
Country in which last significant manufacturing process was carried out
Tariff No:85366930
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.00221