TDK SESUB-PAN-T2541 Bluetooth Smart Module
The ultra-compact SESUB-PAN-T2541 Bluetooth Smart low energy module, with a miniature footprint of just 4.6 mm x 5.6 mm and slim insertion height of 1.0 mm, is believed by manufacturer TDK to be the world’s smallest module for such a device.
- Miniature footprint of just 4.6 mm x 5.6 mm x 1.0 mm
- Power consumption one quarter of classic Bluetooth devices’
- Bluetooth connectivity available simply by connecting to a power supply and antenna
- Substrate layers optimally route all of the I/Os to a BGA on the module’s bottom surface, enabling designers to take full advantage of the chip’s functionality
Product Description
Its compact size makes the new module very well suited for wearable devices, a market that has already seen a rapid rise in consumer interest in recent times and is expected to accelerate in the near future.
The new module is based on TDK’s proprietary SESUB technology (semiconductor embedded in substrate). The Bluetooth IC die is embedded into the thin substrate, while all the peripheral circuitry, including a quartz resonator, bandpass filter and capacitors, is integrated on top.
This design enables the new Bluetooth low energy module to be nearly 65% smaller than modules using discrete components. The new module thus assists the hardware design process and allows easy implementation of Bluetooth connectivity simply by connecting it to a power supply and antenna.
The Bluetooth 4.0 LE specification is intended to reduce the power consumption of battery powered wireless devices significantly. The SESUB-PAN-T2541 Bluetooth 4.0 LE module cuts power consumption to about one quarter of that of classic Bluetooth devices, making it perfectly suited for a wide range of wireless healthcare, sport, fitness, home entertainment and wearable devices, where minimal size, weight and power consumption are essential.