ST BAL-CC1101-01D3 Ultra-Miniature Balun
The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST which are matched to specific RF-transceiver chipsets.
- 50 Ω nominal input / conjugate match to CC1101 / CC1150
- Low insertion loss
- Low amplitude imbalance low phase imbalance
- Coated Flip-Chip on glass
- Small footprint: < 2.1 mm²
Product Description
The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST which are matched to specific RF-transceiver chipsets.
A balun is an electrical device that converts between a balanced signal and an unbalanced signal.
The ETSI1- and FCC2 -compliant BAL-CC1101-01D3 is optimised for ultra-low-power applications in sub-GHz Industrial Scientific and Medical (ISM) and Short-Range Device (SRD) frequency bands. It has been customised for the CC1101 / CC1150 TI transceiver.
The design uses STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimise RF performance.
This configuration delivers advantages that include an integrated harmonic filter delivering improved harmonic attenuation low insertion loss and operation up to 85°C in addition to a tiny footprint.
Typical applications
Ultra-low-power applications in sub-GHz Industrial Scientific and Medical (ISM) and Short-Range Device (SRD) frequency bands.
Physical characteristics
Small footprint: < 2.1 mm² extremely low profile (< 550 μm after reflow).
Other product benefits
High RF performance RF BOM and area reduction.