Samtec SEARAY™ High Density Open Pin Field Arrays

Samtec’s family of SEARAY™ high-speed, high-density arrays offer ultimate design flexibility that is unmatched in the connector industry.

These products allow for maximum grounding and routing flexibility with up to 500 I/0s.

SEARAY™ can be mapped as a single-ended application, differential pair application or a combination of both. When routed as a single-ended system, SEARAY™ is rated up to 12.5 GHz @ a 3dB insertion loss and is rated up to 13.0 GHz @ a 3dB insertion loss for a differential pair system.

SEARAY™ systems utilise Samtec’s patented Edge Rate™ contact system for robust, high-speed performance. This allows for “zippering” when mating and unmating. The Edge Rate™ contacts mate on the smooth milled surface of the contact, thus allowing for higher cycle life and superior electrical properties.

This contact design also lowers insertion and extraction forces - an important consideration when designing in high pin-count arrays.
SEARAY™ also utilises solder charge technology to simplify IR reflow termination and improve solder joint reliability.
The advantage of this technology, compared to standard BGA/solder ball attachment, is that the interconnects are subject to extreme heat only once during assembly of the connector to the PCB as opposed to twice with solder ball attach methods.