Henkel Loctite High Speed Printing, No Clean, Pin Testable Solder Paste
Multicore MP100 medium from Henkel Loctite is a pale, soft residue product for printing and reflow in air, where process yield is critical.
- Version suitable for ultra-fine pitch and 0201 chips
- Long component tack time
- Resists solder balling
- Excellent spread on a wide range of solderable surfaces
- Low colour post reflow residues for easy visual inspection
Product Description
Multicore MP100 medium from Henkel Loctite is a pale, soft residue product for printing and reflow in air, where process yield is critical.
MP100 solder pastes offer excellent open time and greatly extended abandon times. They ensure good soldering activity over a wide range of reflow profile types and surface finishes.
The MP100 paste contains Type 3 (AGS) solder powder, which is formulated for high volume stencil printing applications with component lead pitches down to 0.4mm.
Its flux is formulated to provide excellent wetting on all common board and component lead finishes, including OSP copper that may have been passed through multiple reflow processes in air.
Soldering
The flux in MP100 is formulated to give excellent wetting on all common board and component lead finishes, including OSP copper that may have been passed through multiple reflow processes in air.
Reflow
MP100 solder pastes have been formulated for reflow in air over a wide range of temperature profiles.
Residues
The residues from all MP100 solder pastes are intended to be left on completed assemblies without cleaning. They are designed to pass the normal industry Surface Insulation Resistance, Electromigration and Ionic Contamination tests as well as specific customer Accelerated Life tests. They also have very low colour after reflow, which may be beneficial for auto-inspection equipment.