LOCTITE HF 212 Solder Paste
LOCTITE HF 212 is a solder paste that meets all the current “halogen-free” standards and withstands the thermal demands inherent with larger assemblies.
- Halogen-free (no intended added
halogen in formulation) - No-clean
- Low voiding
- Lead-free
- Excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes
Product Description
LOCTITE HF 212 is a solder paste that meets all the current “halogen-free” standards and withstands the thermal demands inherent with larger assemblies.
It is a no-clean, low voiding Pb-free solder paste that shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn.
LOCTITE HF 212 is suitable for use with industry standard SnAgCu (SAC), high reliability SAC and low silver alloys SAC.
Careful control of the atomisation process for production of solder powders for LOCTITE HF 212 solder pastes also ensures that the solder powder is produced to a quality level that exceeds requirements for sphericity, size distribution, impurities and oxide levels.
All solder powders are RoHS compliant.
Halogen-free flux
Passes IC with pre-treatment IPC-TM-650 2.3.34/EN14582; classification: ROL0 to ANSI/J-STD-004 Rev. B.
Printing
Fine pitch capability (0.3 mm), stencil life (>8 hours), and abandon time (>4 hours); suitable for high speed printing up to 150 mm/s.
Reflow
Solderable on challenging surface finishes (CuNiZn and Copper OSP); colourless residues for easy post-reflow inspection.