2014/10/22
 
 
 
Home > Manufacturers > ST > BAL-CC1101-01D3 Ultra-Miniature Balun
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ST BAL-CC1101-01D3 Ultra-Miniature Balun

The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST, which are matched to specific RF-transceiver chipsets.

  • 50 Ω nominal input / conjugate match to CC1101 / CC1150
  • Low insertion loss
  • Low amplitude imbalance, low phase imbalance
  • Coated Flip-Chip on glass
  • Small footprint: < 2.1 mm²
ST BAL-CC1101-01D3 Ultra-Miniature Balun

Product Description

The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST, which are matched to specific RF-transceiver chipsets.
A balun is an electrical device that converts between a balanced signal and an unbalanced signal.

The ETSI1- and FCC2 -compliant BAL-CC1101-01D3 is optimised for ultra-low-power applications in sub-GHz Industrial, Scientific and Medical (ISM), and Short-Range Device (SRD) frequency bands. It has been customised for the CC1101 / CC1150 TI transceiver.

The design uses STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimise RF performance.
This configuration delivers advantages that include an integrated harmonic filter delivering improved harmonic attenuation, low insertion loss, and operation up to 85°C, in addition to a tiny footprint.

Typical applications

Ultra-low-power applications in sub-GHz Industrial, Scientific and Medical (ISM), and Short-Range Device (SRD) frequency bands.

Physical characteristics

Small footprint: < 2.1 mm², extremely low profile (< 550 μm after reflow).

Other product benefits

High RF performance, RF BOM and area reduction.

 
 
   

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