ST

ST BAL-CC1101-01D3 Ultra-Miniature Balun

The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST which are matched to specific RF-transceiver chipsets.

  • 50 Ω nominal input / conjugate match to CC1101 / CC1150
  • Low insertion loss
  • Low amplitude imbalance low phase imbalance
  • Coated Flip-Chip on glass
  • Small footprint: < 2.1 mm²
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Product Description

The BAL-CC1101-01D3 is the first in a new family of integrated baluns from ST which are matched to specific RF-transceiver chipsets.
A balun is an electrical device that converts between a balanced signal and an unbalanced signal.

The ETSI1- and FCC2 -compliant BAL-CC1101-01D3 is optimised for ultra-low-power applications in sub-GHz Industrial Scientific and Medical (ISM) and Short-Range Device (SRD) frequency bands. It has been customised for the CC1101 / CC1150 TI transceiver.

The design uses STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimise RF performance.
This configuration delivers advantages that include an integrated harmonic filter delivering improved harmonic attenuation low insertion loss and operation up to 85°C in addition to a tiny footprint.

Typical applications

Ultra-low-power applications in sub-GHz Industrial Scientific and Medical (ISM) and Short-Range Device (SRD) frequency bands.

Physical characteristics

Small footprint: < 2.1 mm² extremely low profile (< 550 μm after reflow).

Other product benefits

High RF performance RF BOM and area reduction.